Details

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SWPF SOLVENT-BASED is a low viscosity, solvent based fast evaporating fluid for use in light to medium duty stamping and punching applications. This product has high level of lubricity and offers excellent finishing to the pressed metals without leaving any residue or oily film on the finished components. The fluid is virtually colorless and is most suitable for forming of copper, aluminum and light sheet metal. It can be used for both ferrous and non-ferrous metals and will not stain the material.
 
 
Performance Benefits
 

Fast Drying	Lubricants Metal Surfaces
Provide Quality Finishes and accuracy	Easy Removal
Enhance Die Life	Does not contain harmful or toxic components to the skin